Semiconductor device and manufacturing method thereof

ABSTRACT

A semiconductor device includes a substrate includes a first layer and a second layer over the first layer, a bump disposed over the second layer, a molding disposed over the second layer and surrounding the bump, and a retainer disposed over the second layer, wherein the retainer is disposed between the molding and a periphery of the substrate. Further, a method of manufacturing a semiconductor device includes providing a substrate, disposing several bumps on the substrate, disposing a retainer on the substrate and surrounding the bumps, and disposing a molding between the bumps and the retainer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/181,912, filed Feb. 17, 2014, and claims priority thereto.

BACKGROUND

Electronic equipment using semiconductor devices are essential for manymodern applications. With the advancement of electronic technology,electronic equipment is becoming increasingly smaller in size andcomplicated in structure and functionality. Wafer level packaging (WLP)technology has been gaining popularity and is widely applied. Thistechnology provides a wafer level manufacturing of semiconductor deviceswith high functions and complicated structures while the size of thesemiconductor devices is minimized.

The WLP technology is widely adopted for assembling and combining anumber of semiconductor components to become a semiconductor device soas to minimize the final size of the semiconductor device as well as theelectronic equipment. During assembly operations, the semiconductordevice is sawed and singulated from a wafer by a mechanical or laserblade. The semiconductor device is individualized for subsequentassembly operations. However, the semiconductor device includes manysemiconductor components with complicated structures. The singulationoperations involve many complicated manufacturing processes and as such,the semiconductor device is easily damaged during the singulationoperations.

The sawing operations on the wafer is complicated because it involvesnumerous operations, and such operations that are applied on the smallsemiconductor device include many different kinds of materials withdifferent properties. The differences between materials would increasethe complexity of manufacturing the semiconductor devices and may alsoincrease yield loss. This could result in poor bondability betweencomponents, and cracking or delamination of the components.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A illustrates a top view of an embodiment of a semiconductordevice in accordance with some embodiments.

FIG. 1B illustrates a cross-sectional view of an embodiment of asemiconductor device in accordance with some embodiments.

FIG. 2A illustrates a top view of an embodiment of a semiconductordevice in accordance with some embodiments.

FIG. 2B illustrates a cross-sectional view of an embodiment of asemiconductor device in accordance with some embodiments.

FIG. 3 is a flow chart of a method for manufacturing a semiconductordevice in accordance with some embodiments.

FIG. 4 is a flow chart of a method for manufacturing a semiconductordevice in finer detail in accordance with some embodiments.

FIG. 4A is a top view of a semiconductor wafer with dies separated byscribe lines in accordance with some embodiments.

FIG. 4B is a cross-sectional view of two adjacent dies separated byscribe lines in FIG. 4A in accordance with some embodiments.

FIG. 4C is a schematic view of a passivation layer formed on asemiconductor wafer for structural support and physical isolation inaccordance with some embodiments.

FIG. 4D is a schematic view of a polymer layer formed on a passivationlayer in accordance with some embodiments.

FIG. 4F is a schematic view of bumps disposed onto a post-passivationinterconnect in accordance with some embodiments.

FIG. 4G is a top view of a retainer formed on a substrate in accordancewith some embodiments.

FIG. 4H is a cross-sectional view along a cross-sectional line 1-1 inFIG. 4G in accordance with some embodiments.

FIG. 4I is a schematic view of a liquid molding material dispensed on asubstrate in accordance with some embodiments.

FIG. 4J is a schematic view of a liquid molding material dispensed on asubstrate by screen printing in accordance with some embodiments.

FIG. 4K is a schematic view of a curing process performed to drive outvolatile compounds in a liquid molding material in accordance with someembodiments.

FIG. 4L is a top view of four adjacent dies separated by scribe lines inFIG. 4A in accordance with some embodiments.

FIG. 4M is a cross-sectional view along a cross-sectional line 2-2 inFIG. 4L in accordance with some embodiments.

FIG. 4N is a schematic view of a substrate cut into separated dies froma recess adjacent to a retainer in accordance with some embodiments.

FIG. 5 is a flow chart of a method for manufacturing a semiconductordevice in finer detail in accordance with some embodiments.

FIG. 5A is a top view of a retainer formed on a substrate in accordancewith some embodiments.

FIG. 5B is a cross-sectional view along a cross-sectional line 3-3 inFIG. 5A in accordance with some embodiments.

FIG. 5C is a schematic view of a liquid molding material dispensed on asubstrate in accordance with some embodiments.

FIG. 5D is a schematic view of a curing process performed to drive outthe volatile compounds in a liquid molding material in accordance withsome embodiments.

FIG. 5E is a top view of four adjacent dies separated by scribe lines inaccordance with some embodiments.

FIG. 5F is a cross-sectional view along a cross-sectional line 4-4 inFIG. 5E in accordance with some embodiments.

FIG. 5G is a schematic view of a retainer removed to form a recessseparating two adjacent moldings from each other in accordance with someembodiments.

FIG. 5H is a schematic view of a substrate cut into separated dies froma recess separating two adjacent moldings in accordance with someembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

FIG. 1A and FIG. 1B respectively illustrate a top view and across-sectional view of an embodiment of a semiconductor device 100. Insome embodiments, the semiconductor device 100 includes a substrate 101with a first layer 107 and a second layer 109 over the first layer 107,a bump 113 disposed over the second layer 109 of the substrate 101, anda molding 115 disposed over the second layer 109 of the substrate 101,wherein the molding 115 surrounds the bump 113.

The substrate 101 includes a semiconductor wafer 103 such as a siliconwafer, a semiconductor-on-insulator (SOI) wafer, or any constructioncomprising semiconductor materials. In some embodiments, thesemiconductor wafer 103 includes integrated circuits (IC) orsemiconductor components such as transistors, capacitors, resistors,diodes, photo-diodes, fuses, and the like configured to perform one ormore functions that are formed at the surface of the semiconductorwafer. The IC and semiconductor components are not shown in thisillustration.

In some embodiments, a conductive contact pad 105 is disposed on thesemiconductor wafer 103. In some embodiments, the semiconductor device100 has several contact pads 105 on an upper surface thereof. In someembodiments, the contact pad 105 is made with aluminum (Al), copper(Cu), tin (Sn), nickel (Ni), gold (Au), silver (Ag), or otherelectrically conductive materials. The size, shape, and location of thecontact pad 105 are only for illustrative purposes and are not limiting.The pads 105 of the substrate 101, which are not shown, may be of thesame size or of different sizes.

In some embodiments, the first layer 107 is a passivation layer disposedon the surface of the semiconductor wafer 103 for structural support andphysical isolation. In some embodiments, the passivation layer 107 ismade of silicon nitride (SiN), silicon dioxide (SiO₂), siliconoxynitride (SiON), polyimide (PI), benzocyclobutene (BCB),polybenzoxazole (PBO), or other insulating materials. An opening of thepassivation layer 107 is formed by removing a portion of the passivationlayer 107 to expose a portion of the contact pad 105 while stillcovering the other portion of the contact pad 105. The size, shape, andlocation of the opening that is made are only for illustrative purposesand are not limiting.

In some embodiments, the second layer 109 is a polymer layer disposed onthe passivation layer 107, thereby filling a part of the opening of thepassivation layer 107 over the contact pad 105. In some embodiments, thepolymer layer 109 is formed of a polymer, such as an epoxy, polyimide,benzocyclobutene (BCB), polybenzoxazole (PBO), and the like. However,other relatively soft, often organic, dielectric materials can also beused. The dimensions recited throughout the description are merelyexamples, and will change with the down-scaling of integrated circuits.

In some embodiments, a metal material is used to form a redistributionlayer (RDL) or post-passivation interconnect (PPI) 111 on the polymerlayer 109. In some embodiments, the post-passivation interconnect 111 ismade with, for example, Ti, Al, Ni, nickel vanadium (NiV), Cu, or a Cualloy. In some embodiments, the substrate 101 includes a number ofpost-passivation interconnects 111 so as to form a network, whichelectrically connects to the contact pads 105 according to the functionof the semiconductor device.

In some embodiments, the bump 113 is mount onto the post-passivationinterconnect 111. In some embodiments, the substrate 101 includes anumber of post-passivation interconnects 111, and the semiconductordevice 100 has some bumps 113 disposed respectively onto thepost-passivation interconnects 111. In some embodiments, the bump 113 isamong an array of solder balls formed as a grid, referred to as a “ballgrid array” or “BGA”. However, the embodiments described herein are notlimited to BGA packages or BGA balls. The embodiments are not limited tothe spherical or ball shapes for the solder connectors.

In some embodiments, the bump 113 includes lead-free solders, includingtin, copper, and silver, or “SAC” compositions, and other eutectics thathave a common melting point and form conductive solder connections inelectrical applications. For lead-free solders, SAC solders of varyingcompositions may be used, such as SAC 105 (Sn 98.5%, Ag 1.0%, Cu 0.5%),SAC 305, SAC 405 and the like. Lead-free solders, such as solder balls,may be formed from SnCu compounds as well, without the use of silver(Ag).

In some embodiments, the semiconductor device 100 has several bumps 113with the molding 115 disposed between the bumps 113. In someembodiments, the molding 115 includes a molding compound, which can be asingle layer film or a composite stack. In some embodiments, the moldingcompound includes various materials, for example, one or more of epoxyresins, phenolic hardeners, silicas, catalysts, pigments, mold releaseagents, and the like.

Referring to FIG. 1B, in some embodiments, the molding 115 has aninclined sidewall 115 a adjacent to a periphery of the substrate 101,and the second layer 109 includes a protruded portion 109 a protrudingfrom the sidewall 115 a of the molding 115. Consequently, the uppersurface 109 c of the second layer 109 is not completely covered by themolding 115. In some embodiments, the protruded portion 109 a has asidewall 109 b not aligned with the sidewall 115 a of the molding 115,thereby forming a stepped configuration. In some embodiments, the firstlayer 107 also includes a protruded portion 107 a protruding from thesidewall 115 a. In some embodiments, the protruded portion 107 a has asidewall 107 b aligned with the sidewall 109 b of the second layer 109.In some embodiments, an included angle θ1 of the sidewall 115 a and theupper surface 115 b of the molding 115 is smaller than ninety degrees.In some embodiments, an included angle θ2 of the sidewall 115 a and theupper surface 109 c of the second layer 109 is smaller than ninetydegrees.

FIG. 2A and FIG. 2B respectively illustrate a top view and across-sectional view of an embodiment of a semiconductor device 200.Compared to the semiconductor device 100 shown in FIG. 1A, thesemiconductor device 200 further includes a retainer 201 disposed overthe second layer 109 of the substrate 101, wherein the retainer 201 isdisposed between the molding 115 and the peripheral of the substrate101. In some embodiments, the retainer 201 includes some blocking walls203 adjacent to the periphery of the substrate 101, and the blockingwalls separate the molding 115 from the periphery of the substrate 101.In some embodiments, the retainer 201 is a ring 205 that separates themolding 115 from the peripheral of the substrate 101; in addition, thering 205 surrounds the molding 115.

In some embodiments, the retainer 201 is formed of materials differentfrom the molding compound material. During the molding operation, theretainer 201 breaks the molding 115 that would otherwise form as acontinuous matrix of the molding compound material. Preferably, theretainer 201 formed of stress relief materials can further release thestress of the molding, in addition to breaking the molding. In someembodiments, the retainer 201 is made of a photoresist, silicon nitride(SiN), silicon dioxide (SiO₂), or silicon oxynitride (SiON).

Referring to FIG. 2B, in some embodiments, the protruded portion 109 bof the second layer 109 protrudes from a sidewall 201 a of the retainer201 adjacent to the periphery of the substrate 101. Therefore, the uppersurface 109 c of the second layer 109 is not completely covered by themolding 115. In some embodiments, the sidewall 201 a of the retainer 201is not aligned with the sidewall 109 b of the second layer 109, therebyforming a stepped configuration. In some embodiments, a top end of theretainer 201 is lower than or equal to a top end of the bump 113.

In some embodiments, the retainer 201 has a trapezoidal cross-section.The sidewall 201 a of the retainer 201 is an inclined sidewall adjacentto the periphery of the substrate 101. The width of the retainer 201 atthe upper end is smaller than that of at the bottom end. In someembodiments, an included angle θ3 of the sidewall 201 a of the retainer201 and an upper surface 109 c of the second layer 109 is larger thanninety degrees. In some embodiments, an included angle θ4 of thesidewall 201 a of the retainer 201 and the upper surface 201 b of theretainer 201 is larger than ninety degrees.

FIG. 3 is a flow chart of a method 600 for manufacturing thesemiconductor device 100 shown in FIG. 1B or the semiconductor device200 shown in FIG. 2B in accordance with some embodiments. The method 600begins in operation 601 where a substrate is provided for disposingbumps. Then, a bump is disposed on the substrate in operation 602.Subsequently, a retainer is disposed on the substrate to surround thebump in operation 603. In operation 604, a molding is disposed betweenthe bump and the retainer, wherein the molding surrounds the bump, andthe retainer surrounds the molding.

FIG. 4 is a flow chart of a method 700 for manufacturing thesemiconductor device 200 shown in FIG. 2A in accordance with someembodiments. The method 700 includes a number of operations (701, 702,703, 704, 705, 706, 707, 708, 709, 710).

In operation 701, a semiconductor wafer 103 is provided as shown in FIG.4A, which is a top view of the semiconductor wafer 103 with dies (orcircuit regions) 103 a separated by scribe lines 103 b in accordancewith some embodiments. In some embodiments, the semiconductor wafer 103includes an array of dies 103 a separated from each other by two sets ofintersecting scribe lines 103 b. One set of scribe lines 103 b extendalong a first direction and another set of scribe lines 103 b extendalong a second direction.

FIG. 4B is a cross-sectional view showing two adjacent dies 103 aseparated by scribe lines 103 b in FIG. 4A. In some embodiments, thesemiconductor wafer 103 has several contact pads 105 on an upper surfacethereof. The contact pad 105 is formed by deposition operation such asan electrolytic plating or electroless plating process. In someembodiments, the contact pad 105 has various plating treatments toincrease adhesion, provide diffusion barriers, prevent oxidation, andincrease solderability.

Referring to FIG. 4C, in operation 702, a passivation layer 107 isformed on the semiconductor wafer 103 and on top of the contact pad 105for structural support and physical isolation. In some embodiments, thepassivation layer 56 is formed by a chemical vapor deposition (CVD)process. An opening of the passivation layer 107 is made by removing aportion of passivation layer 107 using a mask-defined photoresistetching process to expose a portion of the contact pad 105.

Referring to FIG. 4D, in operation 703, a polymer layer 109 is formed onthe passivation layer 107, following the contour of the passivationlayer 107, thereby filling a part of the opening of the passivationlayer 107 over the contact pad 105. The polymer layer 109 does notcompletely fill the opening of the passivation layer 107 over thecontact pad 105. Instead, the polymer layer 109 is patterned to form anopening to expose a part of the contact pad 105, while covering the restof the contact pad 105. The patterning of the polymer layer 109 mayinclude photolithography operations. Formation methods of the polymerlayer 109 include spin coating or other commonly used methods.

Referring to FIG. 4E, in operation 704, a metal material is used to forma redistribution layer (RDL) or post-passivation interconnect (PPI) 111on the polymer layer 109 to form a substrate 101, wherein thepost-passivation interconnect (PPI) 111 follows the contour of thepolymer layer 109. In some embodiments, a number of post-passivationinterconnects 111 are formed on the polymer layer 109 so as to form anetwork, which electrically connects to the contact pads 105 accordingto the function of the semiconductor device. In some embodiments, theformation methods of the post-passivation interconnect (PPI) 111 includeelectrolytic plating, electroless plating, sputtering, chemical vapordeposition methods, and the like.

Referring to FIG. 4F, in operation 705, a bump 113 is mount onto thepost-passivation interconnect 111. In some embodiments, a number ofpost-passivation interconnects 111 are formed on the polymer layer 109so as to form a network, and several bumps 113 are formed respectivelyonto the post-passivation interconnects 111. In some embodiments, thebump 113 is one among an array of the solder balls formed as a grid,referred to as a “ball grid array” or “BGA”.

FIG. 4G is a top view showing four adjacent dies 103 a separated byscribe lines 103 b in FIG. 4A, and FIG. 4H is a cross-sectional viewalong a cross-sectional line 1-1 in FIG. 4G. Referring to FIG. 4G andFIG. 4H, in operation 706, a retainer 201 is formed on the substrate101. In some embodiments, a mask-defined photoresist etching process isused to form the retainer 201 including several blocking rings 205 onthe polymer layer 109 of the substrate 101, wherein the retainer 201surrounds the bump 113. In some embodiments, the mask-definedphotoresist etching process includes a resist-coating process, a bakingprocess to drive out the volatile compounds in the resist andsolidifying the resist, and a developing process to strip thenon-solidified resist.

In some embodiments, the retainer 201 is formed of stress reliefmaterials, which is different from the molding compound material. Duringthe molding operation, the retainer 201 breaks the molding 115 thatwould otherwise form as a continuous matrix of the molding compoundmaterial. Preferably, the retainer 201 formed of stress relief materialscan further release the stress of the molding, in addition to breakingthe In some embodiments, the blocking rings 205 are separated from eachother. In some embodiments, the blocking ring 205 includes severalblocking walls 203 on the scribe line 103 b, and the blocking wall 203separates the bump 113 from the periphery of the substrate 101. In someembodiments, the width of the blocking wall 203 is smaller than thewidth of the scribe line 103 b. In some embodiments, the top end of theblocking wall 203 is lower than or equal to the top end of the bump 113.

Referring to FIG. 4I, in operation 707, a liquid molding material 115 ais dispensed on the substrate 101. In some embodiments, the liquidmolding material 115 a is an underfill that flows beneath the bump 113by capillary action. In some embodiments, the liquid molding compound115 a is dispersed inside the blocking rings 205 and surrounds the bump113. In some embodiments, the semiconductor device 200 has several bumps113, and the liquid molding compound 115 a is disposed between the bumps113. In some embodiments, the liquid molding compound 115 a includesvarious materials, for example, one or more of epoxy resins, phenolichardeners, silicas, catalysts, pigments, mold release agents, and thelike.

Referring to FIG. 4J, in some embodiments, the liquid molding material115 a is dispensed on the substrate 101 by screen printing. In someembodiments, the screen printing uses a stencil mask 900 including aframe 901 and several circular patterns 903 surrounding several openings905. After the formation of the retainer 201, the stencil mask 900 isaligned with the substrate 101, and the liquid molding material 115 a issqueegeed through the apertures 905 of the stencil mask 900 and onto theinterior of the retainer 201, thereby printing the liquid moldingmaterial 115 a onto the substrate 101. In the screen printing, the frame901 is aligned with the retainer 201, and the circular patterns 903 arealigned with the bumps 113.

In some embodiments, the top end of the retainer 201 is lower than orequal to the top end of the bump 113. If there is too much liquidmolding material 115 a disposed inside the blocking rings 205 of theretainer 201, the top end of the liquid molding material 115 a is higherthan the top end of the retainer 201. To lower the top end of the liquidmolding material 115 a, a compression process is performed to compressthe top end of the liquid molding material 115 a so as remove a portionof the liquid molding material 115 a above the top end of the retainer201.

Referring to FIG. 4K, in operation 708, a curing process is performed todrive out the volatile compounds, such as moisture or other organiccompounds with low evaporation temperature, in the liquid moldingmaterial 115 a, so as to convert the liquid molding material 115 a intoa solid and supportive molding 115. In some embodiments, the curingoperation is performed at a temperature in a range from about 200° C. toabout 250° C. In some other embodiments, the curing temperature is in arange from about 130° C. to about 180° C. The duration of the curingprocess is in a range from about 1 minute to about 10 minutes, inaccordance with some embodiments.

FIG. 4L is a top view showing four adjacent dies 103 a separated byscribe lines 103 b in FIG. 4A, and FIG. 4M is a cross-sectional viewalong a cross-sectional line 2-2 in FIG. 4L. Referring to FIG. 4L andFIG. 4M, in operation 709, after the formation of the molding 115, adescum process is performed to remove any residual cured moldingcompound from the surfaces of the bumps 113. In some embodiments, duringthe descum process, the surfaces of the bumps 113 are cleaned using alaser so as to remove any residual cured molding compound from thesurfaces of the bumps 113. In some embodiments, the laser cleaning ofthe bumps 113 is conducted with a UV laser.

Referring to FIG. 4N, in operation 710, the substrate 101 is cut intoseparated dies 103 a from a recess 209 adjacent to the retainer 201. Insome embodiments, two adjacent blocking rings 205 form the recess 209over the scribe line 103 b. In some embodiments, these dies 103 a areseparated through a die cutting or singulation process in which,typically, a mechanical or laser saw is used to cut through thesubstrate between individual chips or dies. In some embodiments, thelaser sawing uses an Argon (Ar) based ion laser beam tool 207.

The molding 115 shrinks and expands when heated and cooled, e.g. duringthermal cycling tests, and the shrinking and expansion will createstress on the substrate 101, especially for large die because of thelarge DNP (the distances to neutral point). Without the use of theretainer 201, the molding 115 would form a continuous matrix extendingall the way across the substrate 101. Such a continuous matrix cancreate a substantial stress that is believed to cause a warp of thesubstrate 101 and cracks propagating in the substrate 101 during thethermal cycling tests. By using the retainer 201, the molding 115 isformed between the bumps 113 and the retainer 201 locally, rather thanforming a continuous matrix. Consequently, the warp and cracks of thesubstrate 101 are effectively reduced or eliminated.

In addition, without the use of the retainer 201, the molding 115 wouldbe formed on the scribe lines 103 b, i.e., the scribe lines 103 b wouldbe shadowed, increasing the difficulty for aligning the mechanical orlaser saw with the scribe lines 103 b during the die cutting orsingulation process. In contrast, since there is no molding material onthe scribe lines 103 b, i.e., the scribe lines 103 b are exposed ratherthan being shadowed, and the alignment of the mechanical or laser sawcan be easily carried out. Furthermore, since there is no moldingmaterial on the scribe lines 103 b, the laser saw is workable during thedie cutting or singulation process.

FIG. 5 is a flow chart of a method 800 for manufacturing a semiconductordevice 100 shown in FIG. 1A in accordance with some embodiments. Themethod 800 includes a number of operations 801, 802, 803, 804, 805, 806,807, 808, 809, 810, 811, wherein the operations 801, 802, 803, 804, 805are the same as the operations 701, 702, 703, 704, 705.

FIG. 5A is a top view showing four adjacent dies 103 a separated byscribe lines 103 b, and FIG. 5B is a cross-sectional view along across-sectional line 3-3 in FIG. 5A. Referring to FIG. 5A and FIG. 5B,after performing the operations 801, 802, 803, 804, 805; in operation806, a retainer 301 is formed on the polymer layer 109 of the substrate101. In some embodiments, the retainer 301 includes several blockingwalls 303 disposed over the scribe lines 103 b.

In some embodiments, a mask-defined photoresist etching process isperformed to form the blocking walls 303 of the retainer 301, whereinthe blocking walls 303 surrounds the bump 113. In some embodiments, themask-defined photoresist etching process includes a resist-coatingprocess, a baking process to drive out the volatile compounds in theresist and solidifying the resist, and a developing process to strip thenon-solidified resist.

Referring to FIG. 5C, in operation 807, a liquid molding material 115 ais dispensed on the substrate 101, wherein the liquid molding material115 a is a liquid underfill that flows beneath the bump 113 by capillaryaction. In some embodiments, the liquid molding compound 115 a surroundsthe bump 113. In some embodiments, the liquid molding compound 115 a isdisposed between the bumps 113 and the blocking walls 303 of theretainer 301.

Referring to FIG. 5D, in operation 808, a curing process is performed todrive out the volatile compounds, such as moisture or other organiccompounds with low evaporation temperature, in the liquid moldingmaterial 115 a so as to convert the liquid molding material 115 a into asolid and supportive molding 115.

FIG. 5E is a top view showing four adjacent dies 103 a separated byscribe lines 103 b, and FIG. 5F is a cross-sectional view along across-sectional line 4-4 in FIG. 5E. Referring to FIG. 5E and FIG. 5F,in operation 809, after the formation of the molding 115, a descumprocess is performed to remove any residual cured molding compound fromthe surfaces of the bumps 113.

Referring to FIG. 5G, in operation 810, the retainer 301 is removed toform a recess 401 separating two adjacent moldings 115 from each other.In some embodiments, the retainer 301 is formed of photoresist, and theremoval of the retainer 301 is performed using wet etching, dry etching,or the combination thereof in order to form the recess 401. In wetetching, an etchant includes organic solvents, such as acetone andphenol base compounds or an inorganic solution of sulfuric acid andhydrogen peroxide. In dry etching, oxygen plasma is widely used in thestripping of the photoresist.

Referring to FIG. 5H, in operation 811, the substrate 101 is cut intoseparated dies 103 a from the recess 401 separating two adjacentmoldings 115. In some embodiments, these dies 103 a are separatedthrough a die cutting or singulation process in which, typically, amechanical or laser saw is used to cut through the wafer betweenindividual chips or dies. In some embodiments, the laser sawing uses anArgon (Ar) based ion laser beam tool 207.

Without the use of the retainer 301, the molding 115 would form acontinuous matrix extending all the way across the substrate 101. Such acontinuous matrix can create a substantial stress that is believed tocause a warp of the substrate and cracks propagating in the substrate101 during thermal cycling tests. The molding 115 shrinks and expandswhen heated and cooled during thermal cycling tests, and the shrinkingand expansion will create stress on the substrate, especially for largedie because of the large DNP (the distances to neutral point). After themolding 115 is formed, the retainer 301 is removed to form the protrudedportion 109 a of the second layer 109, such that the molding 115 doesnot cover the entire upper surface of the substrate 101. Consequently,the warp and cracks of the substrate 101 is effectively reduced oreliminated.

In addition, without the use of the retainer 301, the molding 115 wouldbe formed on the scribe lines 103 b, i.e., the scribe lines 103 b wouldbe shadowed, increasing the difficulty for aligning the mechanical orlaser saw with the scribe lines 103 b during the die cutting orsingulation process. The retainer 301 prevents the molding 115 frombeing formed on the scribe lines 103 b. After the molding 115 is formed,the retainer 301 is removed to expose the scribe lines 103 b.Consequently, the alignment of the mechanical or laser saw can be easilycarried out. Furthermore, since there is no molding material on thescribe lines 103 b, the laser saw is workable during the die cutting orsingulation process.

In conclusion, in some embodiments, the semiconductor device includes aretainer or a protruded portion configured to prevent the molding fromcovering the entire surface of the substrate or forming a continuousmatrix extending all the way across the substrate, so as to avoidcreating a warp of the substrate and cracks propagating in the substrateduring thermal cycling tests. Consequently, the warp and cracks of thesubstrate is effectively reduced or eliminated during thermal cyclingtests. In addition, by using the retainer to prevent the molding fromforming over scribe lines so as to allow the scribe lines to be exposedrather than shadowed, the alignment of the mechanical or laser saw canbe easily carried out. Furthermore, since there is no molding materialon the scribe lines, the laser saw is workable during the die cutting orsingulation process.

In some embodiments, a semiconductor device includes a substrateincluding a first layer and a second layer over the first layer, a bumpdisposed over the second layer, and a molding disposed over the secondlayer and surrounding the bump, wherein the second layer includes aprotruded portion protruding from a sidewall of the molding adjacent toa periphery of the substrate.

In some embodiments, a semiconductor device includes a substrateincluding a first layer and a second layer over the first layer, a bumpdisposed over the second layer, a molding disposed over the second layerand surrounding the bump, and a retainer disposed over the second layer,wherein the retainer is disposed between the molding and a periphery ofthe substrate.

In some embodiments, a method of manufacturing a semiconductor deviceincludes providing a substrate including a first layer and a secondlayer over the first layer, disposing several of bumps on the secondlayer, disposing a retainer on the second layer and surrounding theplurality of bumps, and disposing a molding between the bumps and theretainer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A semiconductor device, comprising: a substrateincluding a first layer and a second layer over the first layer; a bumpdisposed over the second layer; and a molding disposed over the secondlayer and surrounding the bump, wherein the second layer includes aprotruded portion protruding from a sidewall of the molding adjacent toa periphery of the substrate, and the molding is in contact with atleast a portion of the bump; wherein an included angle formed by thesidewall of the molding and an upper surface of the molding is smallerthan ninety degrees, and the included angle is inside of the molding. 2.The semiconductor device of claim 1, wherein the first layer includes aprotruded portion protruding from the sidewall of the molding adjacentto the periphery of the substrate.
 3. The semiconductor device of claim1, wherein a sidewall of the second layer is aligned with a sidewall ofthe first layer adjacent to the periphery of the substrate.
 4. Thesemiconductor device of claim 1, wherein the molding has an inclinedsidewall adjacent to the periphery of the substrate.
 5. A semiconductordevice, comprising: a substrate including a first layer and a secondlayer over the first layer; a bump disposed over the second layer; amolding disposed over the second layer and surrounding the bump; and aretainer disposed over the second layer, wherein the retainer isdisposed between the molding and a periphery of the substrate, and themolding is in contact with at least a portion of the bump; wherein anincluded angle formed by a sidewall of the molding and an upper surfaceof the molding is smaller than ninety degrees, and the included angle isinside of the molding.
 6. The semiconductor device of claim 5, whereinthe retainer includes a blocking ring surrounding the molding.
 7. Thesemiconductor device of claim 5, wherein the retainer includes aplurality of blocking walls adjacent to the periphery of the substrate.8. The semiconductor device of claim 5, wherein a top end of theretainer is lower than or equal to a top end of the bump.
 9. Thesemiconductor device of claim 5, wherein the retainer has a trapezoidalcross-section.
 10. The semiconductor device of claim 5, wherein theretainer has an inclined sidewall adjacent to the periphery of thesubstrate.
 11. The semiconductor device of claim 5, wherein an includedangle of a sidewall of the retainer and an upper surface of the retaineris larger than ninety degrees.
 12. The semiconductor device of claim 5,wherein the second layer includes a protruded portion protruding from asidewall of the retainer adjacent to the periphery of the substrate. 13.A semiconductor device, comprising: a substrate; a bump disposed overthe substrate; a molding disposed over the substrate and surrounding thebump; and a retainer disposed over the substrate, wherein the retaineris disposed between the molding and a periphery of the substrate, andthe molding is in contact with at least a portion of the bump; whereinan included angle formed by a sidewall of the molding and an uppersurface of the molding is smaller than ninety degrees, and the includedangle is inside of the molding.
 14. The semiconductor device of claim13, wherein the retainer includes a blocking ring surrounding themolding.
 15. The semiconductor device of claim 13, wherein the retainerincludes a plurality of blocking walls adjacent to the periphery of thesubstrate.
 16. The semiconductor device of claim 13, wherein a top endof the retainer is lower than or equal to a top end of the bump.
 17. Thesemiconductor device of claim 13, wherein the retainer has a trapezoidalcross-section.
 18. The semiconductor device of claim 13, wherein theretainer has an inclined sidewall adjacent to the periphery of thesubstrate.
 19. The semiconductor device of claim 13, wherein an includedangle of a sidewall of the retainer and an upper surface of the retaineris larger than ninety degrees.
 20. The semiconductor device of claim 1,wherein an included angle formed by the sidewall of the molding and anupper surface of the second layer is greater than ninety degrees, andthe included angle is inside of the molding.